Austria Technologie & Systemtechnik AG (AT&S) is the European market leader and one of the globally leading manufacturers of high-value printed circuit boards and IC substrates. AT&S industrializes leading-edge technologies for its business segments mobile devices & substrates, automotive & aviation, industrial electronics, medical & healthcare and advanced packaging. The AT&S Group is active worldwide with sales offices in all continents and production facilities in Europe and Asia: Leoben-Hinterberg and Fehring in Austria, Ansan in Korea, Nanjangud in India and Shanghai and Chongqing in China. Its Head Quarters are located in Leoben-Hinterberg. AT&S employs around 9,900 people worldwide. Each of the plants concentrates on a specific portfolio of technologies. Specifically in Europe, AT&S employees around 1500 people and the production capacity are specified with 140.000 square meters. Among those employees roughly 15 % are engineer-level. The Austrian plants focus on the European and on the American markets. The latter with increasing importance. Short lead times, special applications and greater emphasis on suppliers’ closeness to customers are typical for the European market. The plants in Austria, India and Korea usually concentrate on small and medium-sized batches for industrial and automotive customers, while in China the focus remains on large volumes for mobile communications customers. Shanghai and Leoben-Hinterberg are a major innovative force within the AT&S Group thanks to their research and development facilities. AT&S has recently inaugurated the new high-tech plant in Chongqing in China, entering the IC substrate business as part of a collaboration agreement with a leading global semiconductor manufacturer. AT&S has more than ten years of experience on embedding components and it is the market leader in PCB embedding technologies. AT&S’ embedding core activities are located in Austria turn out to be fundamental for all AT&S locations worldwide. In order to keep up within the harsh market of embedding solutions, it is essential to develop this technology further.
Main tasks in the project
The main AT&S tasks are within WP3 and WP5 with realization integration concepts of an antenna array including thermal management. AT&S will develop the PCB using high frequency build-up materials, fineline structuring and embedded components to realize a project demonstrator. AT&S will contribute also in WP1 and WP3 with interconnect and antenna integration architectures and in WP7 with dissemination and exploitation results of the project.
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